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High Power Burn-In Systems
HPB-4A High-Power Burn In With Test System

HPB-4A High-Power Burn In With Test System

 

High-Power devices have become an industry standard. The HPB-4A Burn-In with Test System meets the challenges created by wide variation in heat dissipation, and the diverse burn-in needs of high-power VLSI devices. The system provides active thermal control to each device to ensure that the proper thermal stress is applied during the burn-in cycle.

Features

  • Individual temperature control for each device up to 600 W

  • Test devices at a maximum temperature of 150°C with a liquid-cooled heat-sink per device.

  • Programmable clocks with leading and trailing edges per pin, one-nanosecond resolution, and 8 on-the-fly timing sets.

  • System capacity of 14 burn-in boards (112 devices)

  • 12 vector formats per-pin per-cycle with memory testing extensions

  • 128 I/O signals per board

  • High-speed clock range of 2 to 400 MHz

  • 64M vector memory, 8G scan

  • 19 programmable voltage regulators provide 2060 amps of device current per burn-in board

  • 16 high-current supplies

    • (0-3.2 Volts up to 125 Amps each)

  • 3 low-current supplies

    • (0-6 Volts up to 20 Amps each)

Benefits

  • Testing capabilities for high-power devices

  • Ensures proper thermal stress for each device

  • Measures device temperature more accurately

  • Testing is more cost-effective due to greater system capacity resulting in higher throughputs

  • Exercise and test high pin count devices or more parts in parallel

  • Run large numbers of test vectors without time-consuming reloads

  • Up to 2000 Watts of device under test power available per slot

  • Translate and run device test programs

  • Clock devices with built-in self-test (BIST) at high speed

  • Flexibility to test complex devices

HPB-5C The Industry Standard for Burn-in of High Power Integrated Circuits

HPB-5C The Industry Standard for Burn-in of High Power Integrated Circuits

The HPB-5C Burn-In with Test System meets the challenges created by wide variation in heat dissipation, and the diverse burn-in needs high-power VLSI devices. The active thermal control feature provided by the HPB-5C ensures that the proper thermal stress is applied to each device during the burn-in cycle.

Features

  • Individual temperature control for each device up to 150 W

  • Variable oven overflow control

  • Individual pattern zone per burn-in board slot

  • 32M vector memory standard, 64M optional

  • Tests devices at a temperature of up to 150°C

  • Up to 800 MHz clock rate

  • 128 digital I/O channels per burn-in board

  • System capacity of 384 devices under test with individual temperature control per device

  • 16 programmable voltage regulators with 1080 amps of device under test power per burn-in board

  • 8 high-current supplies (0-4 volts at up to 125 amps each)

  • 8 low-current supplies (0-6 volts at up to 10 amps each)

Benefits

  • Testing capabilities for high-power devices

  • Ensures proper thermal stress for each device

  • Measures device temperature more accurately

  • Testing is more cost-effective due to greater system capacity resulting in higher throughputs

  • Exercise and test high pin count devices or more parts in parallel

  • Run large numbers of test vectors without time-consuming reloads

  • Up to 16 different pattern zones with on burn-in board per zone

  • Up to 2000 Watts of device under test power available per slot

  • Translate and run device test programs

  • Clock devices with built-in self-test (BIST) at high speed

  • Flexibility to test complex devices

  • Stores failure information without slowing down the test

  • Test both logic and memory functions

  • Flexible system protection control for more detailed reports of failure

LC-2 Production Burn-In and Individual Temperature Control

LC-2 Production Burn-In and Individual Temperature Control

The sophisticated LC-2 Logic and Memory Burn-In System are ideally suited for applications in engineering characterization, life testing, Mil Spec, and commercial production burn-in. The LC-2 handles advanced applications through its ability to perform dynamic burn-in with test by quickly gathering data on a large number of devices, then determining the burn-in fallout rate over time.

Features

  • Large system capacity – 64 burn-in boards

  • Total I/O up to 256 channels per BiB

  • Total power up to 500 DUT current available per BiB

  • Up to 10 individually programmable power supplies

  • Up to 150 Volt power supply outputs

  • 16 user-defined pattern and power zones

  • Total flexibility up to 8M vector memory depth with scan capability per BiB

  • Individual temperature control up to 50 watts, compatible with many BiB sizes

Benefits

  • Ensures proper thermal stress for up to 50W DUTs

  • Enables high-volume production burn-in at the same time

  • Allows use of existing burn-in boards

  • Burn-in multiple device types at the same time

  • Exercise and test more devices in parallel

  • Stress at optimum temperature

  • Programming flexibility

  • Test both logic and memory functions

  • Run test vectors without time consuming reloads

  • Flexible DUT power

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